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青岛理工大学土木工程学院材料科学研究方法课件第六章 SEM及应用。
电沉积制备镍箔的SEM形貌和抗拉强度
电沉积 镍箔 SEM形貌
2009/11/12
研究了电沉积法制取镍箔的实验条件，并对不同条件下得到的镍箔表面、断面SEM形貌以及抗拉强度进行了分析. 结果表明，动态条件下电沉积镍箔，能够显著提高其极限电流密度，此时SEM形貌显示沿电沉积箔的厚度增长方向，纯镍箔的晶粒逐渐增大. 加入5 g/L糖精能够有效地细化晶粒，并使镍箔表面更加光亮，其抗拉强度也有所提高.
Microstructural and thermal analysis of Cu-Ni-Sn-Zn alloys by means of SEM and DSC techniques
Cu-Ni-Sn-Zn alloys DSC technique Scanning electron microscopy
2010/8/16
Most Pb-free solders are Sn-based alloys with addition of low melting metals (such as Zn) or metals forming eutecticts or peritectics with Sn (such as Cu). Copper and nickel are common substrate mater...
X-ray and SEM studies on zirconia powders
X-ray Phase Analysis Electron Microscopy Rietveld method
2010/1/19
Purpose: The microstructure characterization of commercially available zirconia powders was the purpose of
this paper. Different methods of structure analysis were applied owing to the complex, multi...